Publications
X Author: Amit Devpura
2001
Devpura, Amit, Patrick E. Phelan, and Ravi S. Prasher."Size Effects On The Thermal Conductivity Of Polymers Laden With Highly Conductive Filler Particles."Microscale Thermophysical Engineering
5.3 (2001) 177 - 189. DOI
Prasher, Ravi S., J Shipley, and Amit Devpura."A simplified modeling scheme for design sensitivity study of thermal solution utilizing heat pipe and vapor chamber technology."ASME-PUBLICATIONS-HTD
(2001). DOI
2000
Devpura, Amit, Patrick E. Phelan, and Ravi S. Prasher."Percolation theory applied to the analysis of thermal interface materials in flip-chip technology."ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)
1 (2000) 21–28. DOI
Devpura, Amit, Patrick E. Phelan, and Ravi S. Prasher."Percolation theory applied to study the effect of shape and size of the filler particles in thermal interface materials."American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
366 (2000) 365–371.